Reticle
The maximum area a lithography tool can pattern in one exposure (~858 mm2), capping how large a single die can be.
Current numbers
858 mm² (26 × 33 mm)single reticle field (≈26×33 mm) — the area limit every advanced-packaging technique exists to defeat
5.5× (volume, 2026) → 9.5× (2027) → 14× (2028)CoWoS-L reticle multiple: 5.5× in volume (2026), 9.5× and 14× targeted; not the 100×100 mm substrate size.