Microsoft lab-scale in-silicon microfluidic cooling heat removal vs cold plates (up to 65% lower maximum temperature rise)
up to 3xobserved
| Value kind | observed — Reported measurements, counts, and specifications keep the precision and scope stated by their source; an exact specification is not treated as a range. |
|---|---|
| Scope | Microsoft reports lab-scale tests in which microfluidic cooling removed heat up to three times better than cold plates and cut the maximum silicon temperature rise by 65%. Results vary by workload, configuration and chip. |
| Caveat | Lab prototype result, not a production rating. |
| As of | 2025-09 |
| Source | Microsoft, Source feature (23 September 2025) |
| Review | checking…review by 2027-04-14 · standard cadence |
| Recorded changes | last 2026-10-14 · 2 revisions tracked |
| Claim id | in-silicon-microfluidic-cooling-vs-cold-plates |
Where the guide uses it
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