Hybrid-bonding pitch versus ~20–50 µm solder microbumps. TSMC SoIC is 6 µm today; 4.5 µm on A14 roadmap.
<10 µmobserved
| Value kind | observed — Reported measurements, counts, and specifications keep the precision and scope stated by their source; an exact specification is not treated as a range. |
|---|---|
| As of | 2026 |
| Source | UCIe Consortium; Synopsys; TSMC SoIC roadmap (2026 Technology Symposium, reported 14 May 2026) · Interconnect comparison table; copper-to-copper hybrid bonding at ≤10 µm versus solder microbumps at 20–40 µm or larger |
| Review | checking…review by 2027-04-15 · standard cadence |
| Recorded changes | last 2026-10-15 · 3 revisions tracked |
| Claim id | hybrid-bonding-bond-pitch-vs-40-and-ndash-50 |
Where the guide uses it
← Full numbers register — every date-stamped figure in the guide, with revision history.