NVIDIA GB200 NVL72 by HPE nominal rack TDP and cooling split
132 kW nominal TDP: 115 kW liquid + 17 kW airobserved
| Value kind | observed — Reported measurements, counts, and specifications keep the precision and scope stated by their source; an exact specification is not treated as a range. |
|---|---|
| Scope | Exact HPE product profile. Keep this 132 kW / 115 kW liquid / 17 kW air record separate from the OCP MGX Rev. 1.1 reference profile of 120 kW / approximately 102 kW liquid / 18 kW air. |
| Caveat | HPE GB200-specific. GB300 NVL72 differs: Lenovo Press LP2357 (updated 30 August 2026) puts it at ~90% liquid / ~10% air (about 13.5 kW on air at 135 kW rack TDP, ~15.5 kW at the ~155 kW peak), with the NVLink switch trays fully liquid-cooled. Size the residual-air path from the rack you actually buy. |
| As of | 2026-10 |
| Source | HPE, NVIDIA GB200 NVL72 by HPE data sheet, October 2026 edition. · PSN1014890104MYEN, October 2026 edition, p. 2, Advanced Direct Liquid Cooling from HPE |
| Review | checking…review by 2026-12-08 · standard cadence |
| Recorded changes | last 2026-10-14 · 7 revisions tracked |
| Claim id | gb200-nvl72-rack-draw-115-kw-liquid-17-kw-air-1-2 |
Where the guide uses it
- 0.2 How to Read This Guide: Decisions, Consequences & Reference Data
- 1.1 The Archetype Decision Framework: Workload Is the Master Variable
- 1.7 The Requirements-and-Consequences Matrix
- 2.7 Simulation-Driven Design & the Digital Twin as a Design-Validation Tool
- 4.6 LV Distribution: Busway, PDUs, RPPs & Rack Power
- 5.1 Thermal Fundamentals & the Density Wall
- 5.2 Air Cooling at the Limit
- 5.4 Direct-to-Chip Liquid Cooling (DLC) — Architecture, Fluid & Thermal Design
- 6.1 Building Typologies & Data-Hall Layout
- 7.2 NVIDIA Accelerators: Hopper → Blackwell → Vera Rubin → Rubin Ultra → Feynman
- 7.13 The Rack as Integration Unit
- 13.2 Documentation, Scripts & Acceptance Test Plans
- C Decision Tables & Calculators
← Full numbers register — every date-stamped figure in the guide, with revision history.