TrendForce
A market-research firm covering memory, packaging, and component supply, cited for high-bandwidth-memory and cooling-component pricing and availability.
Current numbers
33% → 53% → ~60%liquid-cooling penetration among AI chips: TrendForce's 2025 estimate and 2026–27 projections
~120–140k wafers/monthTSMC CoWoS capacity in 2026, from ~75–80k wafers/month; +50–60k at OSAT partners (TrendForce, June 2026)
1:4–1:8 → 1:1–1:2 CPU:GPU (agentic deployment forecast)TrendForce forecast of deployment-level CPU:GPU ratios for agentic AI