TCS · Technology Cooling System
The secondary liquid loop that carries heat from IT equipment to the CDU; the facility loop rejects that heat onward to the outside world.
Current numbers
132 kW nominal TDP: 115 kW liquid + 17 kW airGB200 NVL72 named profile: ~115 kW liquid plus ~17 kW residual air; both the TCS and room-air duties must close at supported conditions
~50-micronfull-flow TCS filtration (~50-micron typical); separate side-stream polishing can be sub-micron (for example 0.2-micron on premium units)
~7.5–12 °Ctarget coolant delta-T across the TCS; cold-plate pressure drop ~20–55 kPa depending on plate and flow (no vendor-published NVL72 figure)