HBM3E
The enhanced HBM3 generation in 2024–2026 accelerators (H200, B200, B300, GB300, MI355X), faster and denser than HBM3; B300 and MI355X carry 288 GB each.
Current numbers
288 GBMI355X HBM3E capacity at 8 TB/s, ~10.1 PFLOPS dense MXFP4, 1,400 W DLC (CDNA 4, N3P)
~8 → 19.2 TB/sPer-GPU HBM bandwidth, HBM3E (B200/B300) to HBM4 (shipping Vera Rubin, 8 stacks): ~2.4x
192 GBHBM3E per Ironwood (TPU v7) chip @ 7.37 TB/s; 4,614 FP8 TFLOPS; 6x memory vs Trillium