DLC · Direct Liquid Cooling
Direct-to-chip liquid cooling: cold plates remove a named share of component heat through an approved coolant loop. Selection depends on the equipment heat split, component heat flux, airflow/inlet limits, and facility water/rejection envelope—not a universal rack-kW cliff or default.
Cooling that circulates an approved liquid through cold plates on specified components. Residual room-air duty, coolant chemistry, temperatures, flow, pressure, and facility heat rejection remain part of the named equipment design.
Also written as: Direct Liquid Cooling · Direct-to-chip liquid cooling
Current numbers
288 GBMI355X HBM3E capacity at 8 TB/s, ~10.1 PFLOPS dense MXFP4, 1,400 W DLC (CDNA 4, N3P)
~45 °C in / ~55 °C out (Rubin example)chip-side DLC coolant in and out (NVIDIA Rubin example); facility water after the CDU runs a few degrees cooler
~24%share of data-center loss costs that are liquid- or water-related over a multi-year review; DLC adds a new mechanism